Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Support-Q Optimisation of a Trapped Mode Beam Resonator - new

T. H. Hanley[1], H. T. D. Grigg[1], B. J. Gallacher[1]
[1]Newcastle University, Newcastle-Upon-Tyne, UK

Introducing a disorder into a finite periodic oscillatory system induces the presence of a 'trapped mode': a mode in which the displacement field is localised to the region of the disorder. A main inhibitor to MEMS resonators achieving a high quality (Q) factor is energy radiation through the support to the substrate. The trapped modes present a way to tune this to a minimal value. An initial ...

Design of Passive Micromixers using the COMSOL Multiphysics software package

M. Itomlenskis, P. Fodor, and M. Kaufman

Physics Department, Cleveland State University, Cleveland, OH, USA

Relief patterning of the surface of microchannels has been actively pursued as a method of promoting mixing in systems with a low Reynold’s number (<<100). In this work, we explore, by using the COMSOL Multiphysics package and its Chemical Engineering Module, the possibility of enhancing the mixing quality of two fluids in a microchannel with a non-periodic fractal pattern of ridges ...

Robust and Reliability-based Design Optimization of Electromagnetic Actuators Using Heterogeneous Modeling with COMSOL Multiphysics and Dynamic Network Models

H. Neubert[1], A. Kamusella[1], and T-Q. Pham[2]
[1]Technische Universität Dresden, Germany
[2]OptiY e. K. Aschaffenburg, Germany

For an exemplary electromagnetic actuator used to drive a Braille printer, a design optimization was performed. The optimization involves stochastic variables and comprises nominal optimization, robustness analysis and robust design optimization. A heterogeneous model simulates the static and the dynamic behavior of the actuator and its non-linear load. It consists of a network model in ...

Characterization of a Tonpilz Transducer and Performance Analysis for a MEMS-Transducer Array

V. Vadde, and B. Lakshmi G
PESIT

In this paper, we develop and analyze a standard piezoacoustic Tonpilz-transducer model for underwater acoustics in Comsol by addressing the attendant piezoelectric and pressure acoustic multiphysics phenomena. Transducer properties that are studied and characterized are the center frequency, bandwidth, linearity, sensitivity, and noise figure. In an effort to miniaturize the transducer, a ...

Kinetic Investigation of a Mechanism for Generating Microstructures on Polycrystalline Substrates Using an Electroplating Process

T. Soares[1], H. Mozaffari[2], H. Reinecke[1]
[1]Universität Freiburg, Freiburg im Breisgau, BW, Germany
[2]Hochschule Furtwangen, Tuttlingen, BW, Germany

The purpose of this study is to understand the growth mechanism of copper (Cu) films on a Cu-Zn system substrate with a pre-defined pattern. The pattern was defined by conducting a selective etching process on a two-phase polycrystalline substrate. As a result of this process, there were etched regions correspondent to beta-phase crystals and quasi non-etched regions that belong to alpha-phase ...

Void Shape Evolution of Silicon Simulation in COMSOL Multiphysics®

C. Grau Turuelo[1], B. Bergmann[1], C. Breitkopf[1]
[1]Technische Universität Dresden, Dresden, Germany

The void shape evolution of a trench patterned silicon substrate results in diverse cavities by varying initial conditions. The size and the arrangement of the initial trenches are decisive for the transformation process besides the annealing conditions which are, in fact, time and temperature, and the existing pressure values. The prediction of the shape evolution depending on different ...

Looking for the Origin of Power Laws in Electric Field Assisted Tunneling

H. Cabrera[1], D.A. Zanin[1], L.G. De Pietro[1], A. Vindigni[1], U. Ramsperger[1], D. Pescia[1]
[1]Laboratory for Solid State Physics, ETH Zurich, Zurich, Switzerland

A sharp tip approached perpendicular to a conducting surface at subnanometer distances and biased with a small voltage builds a junction across which electrons can be transferred from the tip apex to the nearest surface atom by direct quantum mechanical tunneling. Such a junction is used e.g. in Scanning Tunneling Microscopy (STM). When the distance d between tip and collector is increased ...

Design and Analysis of Fluid Structure Interaction for Elbow Shaped Micro Piping System - new

V. S. P. Rajesh[1]
[1]St. Mary's Group of Institutions, Jawaharlal Nehru Technological University, Hyderabad, Telangana, India

Fluid and structure Interaction analysis can be applied to versatile fields of engineering applications, helps in understanding the affects of one material on other, thereby reducing the effect of physical parameters like nonlinear response, vibration in flow channel etc. Rapid development of technology led to the application of this Fluid-Structure Interaction (FSI) in Microfluidics based ...

Evaluation of Tensile Modulus of Carbon Nanotube Bundle Based Composite with Interface Using Finite Element Method

M. S. Islam, F. O. Riktan, S. C. Chowdhury, M. M. R. Chowdhury, and S. Ahmed
Bangladesh University of Engineering & Technology (BUET)
Dhaka, Bangladesh

Carbon Nanotubes (CNTs) have remarkable mechanical, thermal and electrical properties. The properties of CNTs depend on atomic arrangement (how the sheets of graphite are rolled), the diameter and length of the tubes and morphology of nanostructure. In this paper effective elastic properties of CNT based polymer composites are evaluated using a square Representative Volume Element (RVE) in ...

Heat Generation from Dielectric Loss, Internal Heat Generation and Vibration in COMSOL4.2 Multiphysics

T. R. Jeba, B. Vins, and V. Ramamoorthy
HCL Technologies

This paper presents a FEA approach to estimate temperature rise and thermal stress experienced in PZT/Solid structure due to internal heat generation and dynamic excitation. The power dissipative density consumed by structural damping of the mass structure, internal heat generation due to applied voltage and dielectric loss of the PZT material is first determined. The dissipative power is then ...