Quick Search

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Multifunctional Fluid Power Components using Engineered Lattice Structures

S. Newbauer, D. Cook, and D. Pettis
Milwaukee School of Engineering
Milwaukee, WI

Designing a component with multiple functions, e.g. load bearing and noise attenuation, can increase the effectiveness of each component and reduce the complexity of the overall system, thereby improving system efficiency as well. Current multifunctional components include metal foam. It is posited that the cellular pores of the metal foam can be engineered and optimized for desired ...

Ribbon Formation in Twist-Nematic Elastomers

L. Teresi[1], V. Varano[1]
[1]LaMS - Modelling & Simulation Lab, Università degli Studi Roma Tre, Roma, Italy

Nematic Elastomers (NEs) possess both the elastic properties of rubbers and the orientational properties of liquid crystals. Those two properties makes the configuration of NEs very sensitive to isotropic-nematic phase transition. Our goal is to replicate with numerical experiments the phenomena of shape formation in Twist-Nematic Elastomers (TNEs): a flat bar evolves into a helicoidal shape ...

Modeling the Temperature-Dependent Dynamic Behavior of a Timber Bridge with Asphalt Pavement

B. Weber[1]
[1]Empa, Swiss Federal Laboratories for Materials Science and Technology, Dübendorf, Switzerland

The fundamental frequency and the corresponding damping value are the main design parameters for footbridges against excessive vibrations induced by pedestrians. Since pedestrians typically walk at a pace of 1.6–2.4 Hz, this frequency range as well as the range of the second harmonic, namely 3.5–4.5 Hz, should be avoided. However it has been observed that the fundamental frequency of a bridge ...

Sliding Performance of a Hyperelastic Seal

H. van Halewijn[1]
[1]Physixfactor, Nijmegen, The Netherlands.

A hyperelastic seal is pulled over a metal ring in a coffee machine for maintenance reasons. The force needed to pull the hyper elastic seal over the part is too high and should be reduced for maintenance reasons. Using the COMSOL Multiphysics® Structural Mechanics Module, and using the non-linear hyperelastic for the stick slip movement, a reliable simulation was generated. It resulted in an ...

Simulation of a Seal

V. Viola[1]
[1]CARCO, Basiano, Milano, Italy

Simulations of more than one type of seal have been done where the deformation and the stress of the seal itself or the pressure on the housing are of interest. According to the deformation of the seal we can modify the housing of the seal or its geometry depending on the design constraints to meet. Stresses on the seal are indicators of which changes have to be implemented on the geometry so to ...

Elasto-Plastic FEM Models Explain the Emplacement of Shallow Magma Intrusions in Volcanic Complexes

A. Bistacchi[1]
[1]Università degli Studi di Milano Bicocca, Milano, Italy

We present numerical models and field data that aid understanding of volcano-tectonic processes related to the propagation of inclined sheets and dykes under a stress field resulting from the inflation of a shallow magma chamber. Structural field data from the classical Cuillins cone-sheet complex (Isle of Skye) show that sheets have a constant average dip angle (45°), with pure dilational or ...

Fracture on Circuit Board Internal Layers Due to Thermal Stress on Soldered Pins

F. Figueroa[1], P. Aguirre[1]
[1]Sensor Technik Wiedemann GmbH, Kaufbeuren, Germany

Circuit board failures are often ignored because they could be impreceptible. This simulation examines how internal layers around a soldered pin via subject to temperature changes during the soldering process are affected, show the forces involved and determine breaking points. A 2D thermo-mechanical model of a soldered pin is achieved in two simulation steps. First, a connecting pin already ...

Numerically Closing the Loop of the Adaptive Optics Sensor: the Validation of the COMSOL Multiphysics® Simulation - new

C. Del Vecchio[1], R. Briguglio[1], A. Riccardi[1]
[1]National Institute for Astrophysics, Arcetri Astrophysical Observatory, Florence, Italy

As any other modelling of a physical behavior, the numerical simulation of the mechanical response of an adaptive secondary mirror requires that the results match the experimental data. Such an agreement was recently demonstrated for the local mirror stiffness of the LBT and VLT Deformable Mirrors; a reliable modeling is a good tool for the extrapolation of the missing optical data (spider ...

Numerical and Experimental Analysis of Natural and Mixed Convection Heat Transfer for Vertically Arranged DIMM

G. Petrone, and G. Cammarata
University of Catania, Catania, Italy

 It is commonly recognized that careful thermal design of electronic equipments represents an unavoidable pre-production step in order to ensure reliability and performance of those components during their functioning. This paper mainly concerns a comparison between experimental and numerical results obtained in studying thermal dissipation in natural and mixed convection conditions for RAM ...

Optimization of a High-Temperature High-Pressure Direct Wafer Bonding Process for III-V Semiconductors

R. Martin, J. Kozak, K. Anglin, and W. Goodhue
University of Massachusetts Lowell
Lowell, MA

Many optoelectronic devices utilize a heterojunction of a pair semiconducting materials including high-efficiency MEMS devices, solar cells, LEDs, and VCSELs. One fabrication technique which achieves such a device is direct wafer fusion. To optimize the process, COMSOL Multiphysics 4.0 was used to test various geometric configurations of the fixture. 2D and 3D models were created in order ...