Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

The Full-System Approach for Elastohydrodynamic Lubrication

N. Fillot[1], T. Doki-Thonon[1], and W. Habchi[2]
[1]CNRS, INSA, Université de Lyon, Lyon, France
[2]Department of Industrial and Mechanical Engineering, Lebanese American University, Byblos, Lebanon

A ball is in contact with a plane, and a lubricant separates the two surfaces to decrease friction during their relative motion. To avoid wear, the lubricant film thickness should be higher than the surface roughness. The goal of this paper is to show how it is possible to solve efficiently the problem of elastohydrodynamics lubrication with COMSOL Multiphysics®, using a PDE (Partial ...

Fast 2D Simulation of Superconductors: A Multiscale Approach

V.M. Rodriguez-Zermeno[1], M.P. Sørensen[1], N.F. Pedersen[2], N. Mijatovic[2], and A.B. Abrahamsen[3]
[1]DTU Mathematics, Lyngby, Denmark
[2]DTU Electrical Engineering, Lyngby, Denmark
[3]Materials Research Division, Risø, DTU, Roskilde, Denmark

This work presents a method to calculate AC losses in thin conductors such as the commercially available second generation superconducting wires through a multiscale meshing technique. The main idea is to use large aspect ratio elements to accurately simulate thin material layers. For a single thin superconductor, several standard test cases are simulated including transport current, externally ...

Classical Models of the Interface Between an Electrode and an Electrolyte

E. Gongadze[1], S. Petersen[1], U. Beck[2], and U. van Rienen[1]
[1]Institute of General Electrical Engineering, University of Rostock, Rostock, Germany
[2]Institute of Electronic Appliances and Circuits, University of Rostock,
Rostock, Germany

The Electrical Double Layer (EDL) plays a major role in understanding the interface between a charged surface (e.g. an implant) and ionic liquids (e.g. body fluids). The three classical models of the EDL (Helmholtz, Gouy, and Chapman-Stern) are numerically solved for a flat surface electrode in the 3D Electrostatics application mode of COMSOL Multiphysics® 3.5a. The values of the electric ...

An Acoustical Finite Element Model of Perforated Elements

P. Bonfiglio[1][2] and F. Pompoli[1][2]
[1]Materiacustica S.r.l., Ferrara, Italy
[2]Engineering Department, University of Ferrara, Ferrara, Italy

The present work deals with a numerical investigation of resonating systems used for noise control applications. In literature one can find analytical models based on fluiddynamics concepts for evaluating losses occurring across the holes of the perforates. In the paper an acoustical formulation based on the equivalent dissipative fluid approach will be analyzed. It will be firstly applied to ...

The Acoustoelastic Effect: EMAT Excitation and Reception of Lamb Waves in Pre-Stressed Metal Sheets

R.M.G. Ferrari[1]
[1]Danieli Automation S.p.A., Buttrio, UD, Italy

The acoustoelastic effect relates the change in the speed of an acoustic wave travelling in a solid, to the pre-stress of the propagation medium. In this work the possibility of assessing nondestructively the stress status in metal sheets, by using the acoustoelastic effect, is investigated. As the effect turns out to be very small for practical values of applied stress, the proposed technique ...

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

3D Simulation of the Thermal Response Test in a U-tube Borehole Heat Exchanger

L. Schiavi[1]

[1]Dipartimento di Ingegneria Industriale, Università di Parma, Parma, Italy

Simulated Thermal Response Test (TRT) data are analyzed in order to evaluate the effect of the tridimensionality model’s feature in determining the proper value of the soil thermal conductivity and borehole thermal resistance. The 3D system’s simulation during the TRT is realized by adopting the finite element method. The comparison of the numerical results with the analytical ...

Measuring and Calculation of Positive Corona Currents Using COMSOL Multiphysics®

M. Quast[1] and N.R. Lalic[1]
[1]Gunytronic GmbH, St Valentin, Germany

The sensor type developed by Gunytronic uses corona discharge for measuring flow rates in exhaust streams of automotives, aircrafts and industrial plants. This paper will present the development of testing equipment used in laboratory for investigating physical relations on corona currents, charged particle transport, the calculation of the collateral electric fields and high potentials. This ...

Modelling Thermal Time-of-Flight Sensor for Flow Velocity Measurement

O. Ecin[1], E. Engelien[2], M. Malek[2], R. Viga[2], B. Hosticka[1], and A. Grabmaier[2]

[1]Institut of Mikroelektronische Systeme, University Duisburg-Essen, Duisburg, Germany
[2]Institut of Elektronische Bauelemente und Schaltungen, University Duisburg-Essen, Duisburg, Germany

This communication reports on a numeric fluid dynamics simulation on a pipe flow model. The basic background is to determine the velocity of a flowing fluid in a pipe by using the Thermal Time-Of-Flight (TTOF) method on water. The visualization of the temperature and velocity distribution in the pipe model is being carried out in order to enable proper design and optimization of the TTOF sensor. ...

Mathematical Modeling of Zig-Zag Traveling-Wave Electro-Osmotic Micropumps

J. Hrdlicka[1], P. Cervenka[1], M. Pribyl[1], and D. Snita[1]
[1]Department of Chemical Engineering, Institute of Chemical Technology Prague, Prague, Czech Republic

In this paper we present results of the mathematical modeling of AC electroosmotic micropumps. Unlike others we use the full dynamic description, instead of the linearized model. Skewed hybrid discretization meshes are employed in order to accurately capture the main features of the studied system. Also, we introduce zig-zag electrode arrangements for traveling-wave electroosmotic micropumps. The ...

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