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Thermal Expansion in a MEMS Device

Application ID: 1870

This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library.

The purpose of this model is to exemplify the use of the Material Library in COMSOL Multiphysics. This library contains more than 20,000 property functions for 2500 materials. The larger part of these properties are mechanical and thermal properties for solid materials given as functions of temperature. You need the Material Library to build the model.

This model is included as an example in the following products:

MEMS Module Structural Mechanics Module

The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.