Nonisothermal MEMS Heat Exchanger
Application ID: 516
The example concerns a stainless-steel MEMS heat exchanger, which you can find in lab-on-a-chip devices in biotechnology and in microreactors such as for micro fuel cells. This model examines the heat exchanger in 3D, and it involves heat transfer through both convection and conduction.
The model solves for the temperature and heat flux in the device and investigate the convective term’s influence on the heat exchange.
This model example illustrates applications of this type that would nominally be built using the following products:Heat Transfer Module
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.