Electrodeposition of an Inductor Coil
Application ID: 12613
This example models the deposition of an inductor coil in 3D. The geometry includes the extrusion of the deposition pattern into an isolating photoresist mask, and a diffusion layer on top of the photoresist.
The mass transfer of copper ions in the electrolyte has a major impact on the deposition kinetics, resulting in higher deposition rates in the outer parts of the deposition pattern. The model is solved in a time-dependent study using a moving mesh.
This application was built using the following:Electrodeposition Module
The combination of COMSOL® products required to model your application depends on the physics interfaces that define it. Particular physics interfaces may be common to several products (see the Specification Chart for more details). To determine the right combination of products for your project, you should evaluate all of your needs in light of each product's capabilities, consultation with the COMSOL Sales and Support teams, and the use of an evaluation license.