You are invited to join us for a seminar on Heat Transfer modeling with COMSOL Multiphysics® software. Learn how industry leaders are using COMSOL® software to advance their Heat Transfer research. The seminar will also include three guest speakers and two Heat Transfer minicourses.
The event is free-of-charge and attendees will get a 2-week trial of COMSOL Multiphysics®.
Your COMSOL representatives will be available to answer questions during the day.
- Get an introduction to the capabilities and the fundamental modeling workflow of COMSOL Multiphysics®
- Watch a live presentation of the entire analysis process via a practical example
- See how quick and easy it is to turn your sophisticated model into a specialized application that any engineer can use
Thermal Performance Simulation of Phase Change Memory Cells
The well-known Moore’s "law" sets a target for the downscaling of silicon-based electronic devices. The downscaling of devices may provide better performances, such as increased speed and lower power consumption, leading to a lower cost per bit. This is true for the processor technologies and the memory technologies, such as "flash" and dynamic random-access memory (DRAM) devices as well as phase change memories (PCMs). One of the most serious issues in PCM scaling is the thermal disturbance caused by neighbor cells.
The aim of the study was to develop a computational model to simulate temperatures inside PCM cells. In the presentation, we will show some results and discuss the problems we faced.
In this minicourse, you will learn how to model conductive and convective heat transfer in COMSOL Multiphysics® and the Heat Transfer Module. Conductive heat transfer modeling addresses heat transfer through solids and can include heat transfer in thin layers and contact thermal resistance. Convective heat transfer addresses heat transfer in solids and fluids. We will also address natural convection induced by buoyancy forces. Finally, we will focus on the features to model surface-to-surface radiation for gray surfaces or for multiple spectral bands, such as for solar and infrared radiation.
Numerical Modeling of Anode Baking Process Using COMSOL Multiphysics®
The anode baking process is one of the most important processes in the aluminum industry, as it accounts for 15% of the total costs. The process involves various physics, including turbulent flow, combustion process, radiation, and conjugate heat transfer, that are highly dependent on each other. The ideal anode baking process strives to achieve multiple goals, such as improving anode qualities by providing uniform heat, minimizing energy requirements, reducing NOx production, and reducing soot formation. To optimize the anode baking process and achieve these goals, understanding the process by mathematically modeling the furnace can be important.
The goal of the present work is to find solutions for reducing NOx formation. Therefore, understanding the temperature distribution in the furnace is necessary. The temperature distribution highly depends on the turbulent flow, combustion process, and radiation in the furnace. The model is developed in the COMSOL Multiphysics® software to study the turbulent flow of air and is validated by comparing results with another simulation environment. Subsequently, the combustion process and radiation are added in the model and their effect is studied. In this presentation, results obtained so far will be shown, and some findings will be discussed to resolve convergence problems obtained while solving the model.
Changes in the temperature of a material can lead to a change in material phase, such as from solid to liquid to gas. This advanced minicourse will introduce you to the various types of phase change and moisture transport modeling that can be done with the COMSOL Multiphysics® software and add-on Heat Transfer Module. We will also review different means to define ambient conditions (especially when solar radiation is accounted for) and how to use them in your heat transfer models.
Thermomechanical Analysis for Optimized Architecture of the ADAT3-XF Strip to Strip Eutectic Bonder
The eutectic bonding process deals with contradictions that need to be solved in the system architecture. A high positioning accuracy of ±50 µm (6 sigma), a high process temperature of ±450°C, and a high output of up to 72 kUph are process parameters that are not easy to combine. The aim of using the COMSOL® software was to create a model of the process combined with the machine concept to enable defining the optimal machine concept, meeting all requirements for the lowest cost of goods.
University of Technology Delft
We advise guests for High Tech Campus 1 to park in P0. From there it is about 3 minutes walk to the Conference Center.