Jun 13, 2019 Fairborn, Ohio10:00 AM - 4:00 PM

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You are invited to join us at COMSOL Day Dayton/Fairborn for a day of minicourses, talks by invited speakers, and the opportunity to exchange ideas with other simulation specialists in the COMSOL community.

Below, you will find a preliminary schedule for COMSOL Day. Minicourse topics may include heat transfer, high-frequency electromagnetics, optics, acoustics, fluid flow, solvers, optimization, postprocessing, RF, antennas, and more. You are welcome to attend any portion of the event.

Stay tuned for more details. A full event schedule will be announced soon.

Register for free today.


Welcoming Remarks

This introductory demonstration will show you the fundamental workflow of the COMSOL Multiphysics® modeling environment. We will demonstrate the process of transforming fully defined models into specialized simulation applications. Get introduced to application deployment products such as COMSOL Compiler™ and COMSOL Server™.

Coffee Break

Learn how to model electromagnetic heating for low- and high-frequency electromagnetics applications. Important electromagnetic heating phenomena covered include Joule heating, induction heating, RF heating, and laser heating.

Break for Lunch

In this session, a panel of users from industry will share their experiences on best modeling practices and validation methods they follow while using COMSOL Multiphysics® to improve modeling efficiencies.


Learn how to model mass, momentum, and energy transport in order to simulate nonisothermal flow including chemical reactions in COMSOL Multiphysics®.

Coffee Break

Get a brief overview of using the Acoustics Module and Structural Mechanics Module within the COMSOL® software environment.


Learn to use gradient-based optimization techniques and constraint equations to define and solve problems in shape, parameter, and topology optimization, as well as inverse modeling. The techniques shown are applicable for almost all types of models.


COMSOL Day Details


Holiday Inn Dayton / Fairborn
Challenger/Discovery Room 2800 Presidential Drive
45324 Fairborn, Ohio

COMSOL Speakers

Yeswanth Rao
Yeswanth Rao is a technical sales manager and has been with COMSOL since early 2008. He holds a PhD in biological engineering and a master's degree in electrical engineering. His finite element background is in MEMS, particularly piezoelectric modeling.
Nithin Jacob
Nithin Jacob joined COMSOL in 2015 and currently works as a technical sales engineer. He received a master's degree in mechanical engineering from Arizona State University and his interests include structural mechanics and product development.
Chandan Kumar
Chandan Kumar is an applications engineer specializing in structural mechanics and the analysis and design of microelectromechanical systems. He joined COMSOL in 2009. He earned his PhD from Penn State University, where he studied the dynamics of the self-assembly of semiconductor quantum dots. He is a senior member of IEEE.
Aline Tomasian
Aline Tomasian is an applications engineer at COMSOL, specializing in high- and low-frequency electromagnetics. She holds a BS in physics from Worcester Polytechnic Institute.

Invited Speakers

Folusho Oyerokun
GE Aviation
Dr. Folusho Oyerokun is a materials scientist in the Engineering Materials Systems department at GE Aviation in Cincinnati, OH. He received his graduate degrees from the Massachusetts Institute of Technology (SM in aeronautics and astronautics, with specialization in propulsion) and the University of Illinois, Urbana-Champaign (PhD in materials science and engineering, specializing in polymer statistical mechanics). Dr. Oyerokun has an extensive background and experience in theoretical and computational (atomistic and continuum) modeling of thermofluids and nanostructured polymeric and ceramic materials. At GE Aviation, Dr. Oyerokun uses {:comsolmph} to model the thermophysical processes involved during the manufacturing of ceramic matrix composites components for gas turbine engine applications.
Rick Beyerle
NeoGraf Solutions, LLC.
Rick Beyerle is a senior development engineer and heat transfer specialist at NeoGraf Solutions, LLC. Rick is responsible for developing measurement and modeling techniques for graphite heat spreaders, thermal interface materials (TIMs), and gap pads as well as nonelectronics applications of graphite. His work on SpreaderCalc, a web-based {:comsol} application for simulating heat flow in highly anisotropic graphite foils, appeared in COMSOL’s _Multiphysics Simulation_ in 2016.

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