November 28–29

COMSOL Conference Bangalore 2019

You are invited to attend the COMSOL Conference 2019 to advance your numerical simulation skills and connect with fellow modeling and design experts. This event focuses on multiphysics simulation and its applications. A great variety of sessions offer everything from inspiring keynotes by industry leaders to 1-on-1 discussion with application engineers and developers. You can customize the program to your specific needs, whether the purpose is learning new modeling techniques or connecting with fellow users of the COMSOL® software. Join us at the COMSOL Conference to:

  • Stay up-to-date with current multiphysics modeling tools and technologies
  • Pick up new simulation techniques in a variety of minicourses and workshops
  • Present a paper or poster and gain recognition for your design and research work
  • Interact with your colleagues in industry-specific panel discussions
  • Get assistance for your modeling problems at demo stations
  • Learn how to build and deploy simulation applications for your team or organization
  • Draw inspiration for your next design innovation from leaders in multiphysics simulation
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Schedule November 28-29

9 a.m.
Registration Opens
10 a.m.
Introduction to COMSOL Multiphysics®
10:45 a.m.
11 a.m.
Welcome and Keynotes
  • Ishant Jain is a Research & Development (R&D) professional with over 10 years of industry exposure and academic research experience. Proven competence across a gamut of domains including Electrical, Mechanical, Materials, & manufacturing. Expertise across the fields of Overhead equipment for Railway Tractions, HV/LV electrical accessories for power distributions like insulators, connectors etc., Industrial heating, steelmaking & casting process and transformers.

    Ishant Jain is currently working as Head of the Department (Program manager), Material and Processing CoE, at Raychem Innovation Center based in Vadodara. He has completed his B Tech (Hons) in Mechanical Engineering from MIET and M. Tech in Material and Metallurgical Engineering from Indian institute of Technology Kanpur. He had worked as a senior researcher with TATA steel R&D Jamshedpur. Since 2014 he is working with Raychem RPG developing new products for the energy and power sector.

    Ishant Jain is TRIZ level 2 certified and a Green belt in six sigma. He has authored more than 15 technical papers in renowned national and international journals and has filed 20 patents to his credit. He has contributed in FEA analysis, Electro Thermal - heat transfer, Multi Body Dynamics, CFD and non-linear structural mechanics, static and dynamic analysis.

  • Dr. R Venkataraghavan is a technology and innovation leader with over 20 years of research and work experience in academia, industry, and business. He is currently a senior research scientist at Unilever R&D Bangalore and an adjunct faculty member at IIT Palakkad. He is also on the advisory board of a few organizations.

    His research interests are in the areas of product design & engineering, materials science, and environmental science, focusing on applications in water treatment and sustainable plastic use. He is passionate about purposeful innovations that positively impact people and the planet.

    An avid tech enthusiast, dabbling in gadgets like Arduino and Raspberry Pi, he also enjoys teaching and mentoring young colleagues and strongly believes in collaboration to uncover solutions.

12:40 p.m.
1:45 p.m.
  • In this minicourse, you will learn about modeling conductive and convective heat transfer with phase change using the COMSOL Multiphysics® software, Heat Transfer Module, CFD Module, and Subsurface Flow Module.

    Conductive heat transfer modeling addresses heat transfer through solids and can include heat transfer in thin layers, contact thermal resistance, and phase change. Convective heat transfer addresses heat transfer in solids and fluids. We will show you how to model natural convection induced by buoyancy forces. Additionally, changes in the temperature of a material can lead to a change in material phase, from solid to liquid to gas. This minicourse will introduce you to the various types of phase change modeling that can be done with COMSOL Multiphysics®. We will also discuss how lumped thermal equivalent circuit components can be used for heat transfer analysis, and how they can be coupled to the heat transfer FE models.

  • Get an overview of the general functionality for laminar flow in the CFD Module, followed by a detailed description of the functionality added with the Microfluidics Module. The Microfluidics Module features custom interfaces for the simulation of microfluidic devices. Single-phase flow capabilities include both Newtonian and non-Newtonian flow. Beyond the single-phase flow capabilities, the Microfluidics Module also allows for two-phase flow simulations to capture surface tension forces, capillary forces, and Marangoni effects. Typical applications include lab-on-a-chip (LOC) devices, digital microfluidics, electrokinetic and magnetokinetic devices, inkjets, and vacuum systems.

  • In this minicourse, you will learn different approaches for modeling layered shells in COMSOL Multiphysics®. The Layered Shell interface will be covered in detail, including the modeling of delamination. You will also learn how to extract homogenized material properties from a micromechanical model using a representative volume element approach. Finally, the analysis of multiphysics problems in layered shells will be discussed.

  • The high-fidelity simulation of optical systems in particularly harsh environments must account for the impact of thermal and structural effects on optical performance. For example, the large temperature changes found in outer space and high-powered laser focusing systems can change the refractive indices due to thermo-optic dispersion. Under extreme conditions, the elements of the optical system may experience significant thermal stress, causing physical deformation and a further degradation of the image quality.

    In this minicourse, you will learn how to use the Ray Optics Module to perform coupled structural-thermal-optical performance (STOP) analyses of optical systems. You will learn how to use COMSOL Multiphysics® to compute temperature and displacement fields using the finite element method (FEM) and then couple these fields to a ray optics simulation using built-in optical dispersion models. The distinction between unidirectional and bidirectional couplings in STOP analysis models will also be explained.

  • In this minicourse, you will learn how to model problems within the field of structural mechanics. You will learn about the modeling of stresses, strains, and deflections in solid materials and mechanisms. Stationary, transient, and frequency-domain analysis; eigenfrequency analysis; and modal superposition will be covered. Shells, membranes, beams, and trusses will also be introduced. Damping models, nonlinearities, linearization, and prestressed analysis are other important topics.

  • In this minicourse, you will learn how to define chemical kinetics, thermodynamic properties, and transport properties for models of reacting systems using the Chemical Reaction Engineering Module. We will address topics including homogeneous and surface reactions, diffusion and convection in diluted and concentrated solutions, thermal effects on transport and reactions, and mass and heat transfer in heterogeneous catalysis.

3:15 p.m.
3:30 p.m.
User Presentations
4:45 p.m.
5 p.m.
  • In this minicourse, we will walk you through the meshing techniques that are available to you in the COMSOL Multiphysics® software. We will introduce you to basic meshing concepts, such as how to tweak the meshing parameters for unstructured meshes. More advanced topics include working with swept meshes and creating mesh plots. You will also learn a useful technique for meshing imported CAD designs: How to hide small geometry features from the mesher.

  • The Application Builder, included in the COMSOL Multiphysics® software, allows you to wrap your COMSOL Multiphysics® models in user-friendly interfaces. This minicourse will cover the two main components of the Application Builder: the Form Editor and the Method Editor. You will learn how to use the Form Editor to add buttons, sliders, input and output objects, and more. You will also learn how to use the Method Editor and other tools to efficiently write methods to extend the functionality of your apps.

  • Importing CAD designs often involves modifying the geometry after the import; for example, to remove unwanted details, create additional computational domains, or even restore missing faces. Besides demonstrating the tools for these tasks, this minicourse will also cover best practices for working with imported CAD geometries and how to interface CAD software using the LiveLink™ interface for an efficient optimization of CAD designs.

  • Attend this minicourse to learn about the tools for generating geometry with COMSOL Multiphysics®. We will cover how to efficiently build geometry that can be parameterized and look into more advanced techniques; for example, how to create a geometry from simulation results. Generating a geometry also involves preparing selections for physics settings. By using the right selection tools, you can easily automate the modeling workflow, even when this involves simulations on widely different versions of a geometry.

  • In this minicourse, we will cover the use of the RF Module and Wave Optics Module for simulating Maxwell's equations in the high-frequency electromagnetic wave regime. We will discuss applications in resonant cavity analysis, antenna modeling, transmission lines and waveguides, periodic structures, and scattering. Then, we will address the coupling of electromagnetic wave simulations to heat transfer, such as in RF heating.

6:30 p.m.
Poster Session
8 p.m.
Gala Dinner
8 a.m.
9 a.m.
  • Radiative heat transfer is one of the three types of heat transfer and plays a major role in many applications. During this session, we will focus on the features for modeling surface-to-surface radiation for gray surfaces or multiple spectral bands, such as solar and infrared radiation. We will discuss different examples in order to help identify cases where thermal radiation has to be accounted for.

  • In this minicourse, you will learn how to define and solve problems in electrodeposition, corrosion protection, and corrosion studies. These systems all involve mass and charge transfer coupled to electrochemical reactions at deforming metal surfaces. We will look at two different approaches: one that treats the surface deformation as a variable and a second approach that treats the surface deformation with moving mesh. The most common type of study for these systems is the time-dependent study, but we will also briefly look at electrochemical impedance spectroscopy (EIS) studies.

  • In this minicourse, we will study different classes of problems involving acoustic propagation in fluids and solids, ranging from propagation in large domains, such as rooms or the ocean, to transmission through small perforations, where thermal and viscous losses are important. We also discuss modeling the interaction of elastic waves in solids and pressure waves in fluids (ASI) as well as propagation in moving fluids; that is, convected acoustics or aeroacoustics. You will also learn about recent news and additions to the COMSOL Multiphysics® software relevant to acoustics. Application areas include, but are not limited to, muffler design, sound insulation materials, room and car acoustics, flow meters, and liners.

  • Magnetic fields arise due to magnets and the flow of current. In this minicourse, you will learn about using the AC/DC Module to model static, transient, and frequency-domain magnetic fields that arise around magnets and coils. We will introduce various ways of modeling magnetically permeable materials, motors, and generators.

  • This minicourse is focused on modeling joints, gears, cams, springs, and dampers in flexible multibody systems. You will also get an introduction to including nonlinear materials, using lumped modeling techniques, and modeling the multiphysics of such systems. In addition, we will cover the dynamics and stability of rotors and rotating components. You will learn techniques for modeling rotors and associated components using both solid and beam elements, as well as various methods for modeling bearings and foundations. If you are interested in learning about the Multibody Dynamics Module and the Rotordynamics Module, this minicourse is for you.

10:30 a.m.
10:45 a.m.
User Presentations
11:45 a.m.
12 p.m.
Keynotes and Awards Ceremony
  • Jiyoun Munn is the technical product manager for the RF Module at COMSOL and a senior member of IEEE. He has 2 decades of experience in the RF industry, creating more than 150 antenna and microwave device prototypes and holding patents for antenna interrogation systems. He has an MS in electrical engineering from the University of Michigan.

1:45 p.m.
2:45 p.m.
  • In this minicourse, you will learn how to model batteries with a focus on lithium-ion batteries, including transport of ions, porous electrodes, and electrode reactions. You will also get an introduction to the corresponding couplings to heat transport for performing thermal simulations. We will address how to simulate various transient phenomena, such as constant current-constant voltage (CCCV) charge/discharge cycling, electrochemical impedance spectroscopy (EIS), and capacity fade.

  • In this minicourse, we will address the modeling of resistive and capacitive devices with the AC/DC Module. We will also cover the calculation of electric fields under steady-state, transient, and frequency-domain conditions, as well as the extraction of lumped parameters such as capacitance matrices. Applications include the modeling of resistive heating and sensor design.

  • This minicourse is focused on modeling all kinds of transducers. The transduction from an electric signal to an acoustic signal, including the mechanical path, is a true multiphysics application. We will set up a simple model using the built-in multiphysics couplings and also look at other modeling techniques, like combining lumped models with FEM or BEM. The analysis can be done in the frequency domain or extended to the time domain, where nonlinear effects can be included. You will also learn about recent news and additions to the COMSOL Multiphysics® software relevant to the topic. Application areas include, but are not limited to, mobile devices, piezotransducers, loudspeakers, headsets, and speaker cabinets.

  • Learn how to use the Application Builder and the Method Editor to automate your model building, including setting up the geometry, material properties, loads, and boundary conditions; meshing; solving; and extracting data. You will learn how the Application Builder can be a powerful tool in your modeling process.

  • Learn how to efficiently simulate incompressible and compressible turbulent flows. The CFD Module allows for accurate multiphysics flow simulations, such as conjugate heat transfer with nonisothermal flow and fluid-structure interactions. Physics interfaces for simulating high Mach number flow, flow in porous media, thin-film flow, and flow in stirred vessels with rotating parts will also be presented. This is followed by a description of the different turbulence models and their applicability to various types of flow problems.

  • This minicourse builds upon static and dynamic modeling to address questions of material nonlinearity and fatigue. We will cover the various nonlinear material models used for modeling metals, polymers, soils, and ceramics. Furthermore, we will discuss creep modeling and structural and thermal fatigue modeling.

4:15 p.m.
4:30 p.m.
  • Looking to increase your productivity when using the COMSOL® software? From setting up to postprocessing your COMSOL models, this session will showcase time-saving techniques. Regardless of your engineering field, following best practices will help you get the most out of your modeling efforts, efficiently.

  • Solving large and complex finite element models can take significant time and computational resources. In this minicourse, we will address the modeling techniques that you should be aware of and then go into the choice of solvers for large models. We will cover the differences between the various solvers in the COMSOL Multiphysics® software in terms of their time and memory usage. Additionally, solver performance is inextricably linked to computer architecture. This course will discuss how factors such as memory bandwidth, processor speed, and architecture affect solution times.

  • COMSOL Multiphysics® gives you precise control over the way in which your multiphysics models are solved. It also includes a set of powerful implicit time-stepping algorithms for fast and accurate solutions to transient models. In this minicourse, we will cover the fundamental numerical techniques and underlying algorithms used for steady-state models and explain the reasons behind the default solver settings. Building upon this knowledge, you will learn various techniques for achieving or accelerating convergence of nonlinear multiphysics models. You will also learn how to pick a solver based on the problem at hand, measure and control computational error, as well as check convergence and other salient issues in time-dependent analyses using the finite element method.

  • Shape optimization involves the free-form deformation of your CAD part via the Deformed Geometry interface. It is possible to set up such a deformation with respect to just a few control variables, and use these variables within the gradient-based optimization capabilities of the Optimization Module to quickly come up with improved designs. Often, setting up such a deformation can be quite challenging. Come learn how to efficiently set up and solve such models.

  • When presenting your results, the quality of the postprocessing will determine the impact of your presentation. This minicourse will thoroughly explore the many tools in the Results node designed to make your data look its best, including mirroring, revolving symmetric data, cut planes, cut lines, exporting data, joining or comparing multiple data sets, as well as animations.

Conference Venue

ITC Gardenia

1, Residency Road, Shanthala Nagar,
Ashok Nagar, Bengaluru,
Karnataka 560025

Get Directions


From Kempegowda International Airport
The hotel is 39 km from the Kempegowda International Airport. You could take either an airport taxi or an app-based taxi to the conference venue. Taxis are readily available outside the Arrivals terminal and do not require advance booking. The approximate ride fare would be ₹900. Alternatively, you can take a bus service, KIAS 5 or KIAS 7, and stop at the Richmond Circle bus stop or the Mallaya Hospital bus stop for the respective routes. The hotel is about 700 m and 400 m from the respective bus stops.
From Bangalore City Railway Station

The hotel is 5 km from the Krantivira Sangolli Rayanna Railway Station (Bangalore City Railway Station). You could take an app-based taxi or an auto rickshaw to the conference venue. Taxis are readily available outside and do not require advance booking. There are multiple buses from the Majestic Bus stand (opposite the railway station) to the hotel. Find a suitable bus route here.


Hotel Website

We recommend that conference attendees stay at the conference venue, the ITC Gardenia. During the conference, lunch and refreshments are included both days. On November 28th, COMSOL will also host a gala dinner at the conference venue. There is free parking for conference attendees.

If you would like to explore other options for your stay near the conference venue, click here.

Get ready to connect, learn, and innovate. Join the top minds in science, physics, and engineering for 2 days of learning, talks by industry experts, and presentations featuring cutting-edge R&D.



Connect with the brightest minds in numerical simulation at the COMSOL Conference 2019 Bangalore.

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