Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

FEM Study on Contactless Excitation of Acoustic Waves in SAWDevices

A. K. Namdeo[1], N. Ramakrishna[2], H. B. Nemade[1,2], and R. P. Palathinkal[1]

[1] Department of Electronics and Communication Engineering, Indian Institute of Technology Guwahati, Assam, India
[2] Centre for Nanotechnology. Indian Institute of Technology Guwahati, Assam, India

In this paper a finite element method(FEM) study of a surface acoustic wave (SAW)device excited by electrostatic coupling method is performed by using COMSOL Multiphysics. We have modeled a Rayleigh wave type SAW device by choosing YZ Lithium niobate as the substrate. The effect of external radio frequency (RF) field to the SAW device is analyzed. The effect of distance between the contactless ...

Zone sculpting using partitioned electrokinetic injections

Narovlyansky, M.1, Squires, T.M.2, Whitesides, G.M.1
1 Department of Chemistry and Chemical Biology, Harvard University, Cambridge, MA, U.S.A.
2 Departments of Physics and Applied Mathematics, Caltech, Pasadena, CA

In electrokinetic separations, the narrower and more homogeneous the initial sample plug, the higher the ultimate resolution of the separation. Here we describe a general and versatile method to sculpt low-dispersion, high-fidelity sample zones in microfluidic devices for high resolution electrokinetic separations. In a simple channel intersections microfabricated partitions act to reduce each ...

Applied Multiphysics in Thermoresistive and Magnetoresistive Sensor Models

R.W. Pryor
Pryor Knowledge Systems, Inc.
COMSOL, Certified Partner

Efficient, effective, and functional operation of autonomous systems requires a comprehensive real-time understanding, by those systems, of the embedding environment. This paper presents a brief overview of the multiphysics considerations involved in the development of models for thermoresistive and magnetoresistive sensors systems.

Viscous damping of a periodic perforated MEMS microstructure when the Reynolds’ equation cannot be applied: Numerical simulations

D. Homentcovschi[1], and R.N. Miles[1]
[1]Department of Mechanical Engineering, SUNY Binghamton, NY

This paper develops a computational model for determining the total damping coefficient for a unit cell of a MEMS microscale device containing a repetitive pattern of holes. The basic cell of the microstructure is approximated by an axi-symmetric domain and the velocity and pressure fields are determined from solutions of the Navier-Stokes equations using the finite element software package ...

Investigating the Use of a Piezoelectric Actuator for the Appendages of a Microrobot

J. Clark, and J. Clark
Purdue University, West Lafayette, IN, USA

We investigate the use of a piezoelectric actuator for the appendages of a microrobot. Possible uses may include micro assembly, mobile surveillance, etc. What is different about this microrobot is that it uses 2 degrees of freedom, low powered piezoelectric flexures, while attempting to mimic the maneuverability of an ant-like insect. In the paper, we use COMSOL to characterize this type of ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.

Electromagnetic Release Process for Flexible Electronics

G. Coryell[1][,][2]
[1]School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, USA
[2]Chemistry Department, United States Naval Academy, Annapolis, MD, USA

Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a freestanding flexible substrate such as polyimide would distort unacceptably during even minor temperature excursions ...

Effect of Mass Adsorption on a Resonant NEMS

J. J. Ruz Martinez
Instituto de Microelectronica de Madrid
Tres Cantos
Madrid, Spain

The motion of a resonant NEMS has been widely studied for many different applications such as structural mechanics in engineering, ultra sensitive mass spectrometers or the well known Atomic Force Microscope. The study of the eigenfrequencies of such structures is very important, and nowadays there are good theoretical methods to accurately predict such eigenfrequencies. When a little mass is ...

Design and Simulation of MEMS Based Electrothermal Micromirror for 3D Spatial Movement

D. Mallick, and A. Bhattacharyya
Institute of Radio Physics and Electronics
University of Calcutta
West Bengal, India

Micromirror is a versatile MEMS device, which finds use in many application areas. In this paper, we have addressed the issues related to the design and behavioral simulation of MEMS based electro-thermal micromirror [Figure 1] for 3D motion. Two types of thermal actuation mechanism are used in the designed device. For in-plane movement poly-silicon made two-hot-arm actuatoris used. Here, the ...

Micro Cooling of SQUID Sensor

B. Ottosson[1], Y. Jouahri[2], C. Rusu[1], and P. Enoksson[2]
[1]Imego AB, Gothenburg, Sweden
[2]Chalmers University of Technology, Gothenburg, Sweden

The objective of this work has been to realize a feasibility study of a cooling device for a SQUID sensor using liquid nitrogen flowing through micro channels. The design consists of an epoxy cylindrical vacuum vessel skewed by a silicon microchannel heat sink. The SQUID sensor is situated directly on top of the microchannel heat sink. The device is used at room temperature and should be able to ...

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