Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Thermo-mechanical Behavior of Multilayers

Bilotsky, Y., Gasik, M.
Laboratory of Materials Processing and Powder Metallurgy, HUT, Finland

The model for study of thermal mechanical behavior of multilayer thin films was developed. The stress-strain analysis was carried out in combination with thermal effects. The 2D thinfilm model has been solved by FEMLAB 3.1i. The middle layer was thermally loaded with Ohmic heating and other layer’s thicknesses were varied in time. All material data like elastic coefficients, thermal ...

Use of COMSOL to Estimate the Thermal Properties and Kinetic Parameters for the Degradation of Anthocyanins in Grape Pomace

D.K. Mishra[1], and K.D. Dolan[1,2]
[1] Department of Biosystems and Agricultural Engineering, Michigan State University
[2] Department of Food Science and Human Nutrition, Michigan State University

Degradation of components in low-moisture and high-temperature food is difficult to model because of the temperature gradient and long heating time. A method was developed to estimate the thermal properties of grape pomace and the rate constant and activation energy of anthocyanin degredation.

FE Model of Thermo-Mechanical Interaction in Rubber Blocks under Dynamic Cyclic Stress

L. Pešek
Petr Šulc Institute of Thermomechanics

In this paper, we investigate the feedback thermo-mechanical interaction in a pre-pressed rubber block used for resilient elements of composed tram wheels. The structural motion and heat conduction equations are solved interactively as a time-dependent problem. The equality of heat energy density and dissipation energy density realizes the coupling between the equations. The dissipation ...

Ampacity Simulation of a High Voltage Cable Used in Offshore Wind Farms

E. Pelster[1]
[1]Wenger Engineering, Ulm, Germany

The ampacity of a cable depends on the cross section of its conductor. When selecting a cable design for a specific application it is of interest to choose the lowest possible conductor cross section in order to reduce material costs. Therefore an exact calculation of the ampacity is necessary (it is usually limited by the thermal resistance of the insulating cable materials). Commonly the ...

Inductive Heating Modelling with a Temperature-controlled Material

Hemous, R.
RocTool, France

Roctool is a company which develops and sells some process to heat and transform composite materials very quickly. One of these, the Cage System®, uses an inductive heating process which heats instantaneously the tooling surface of the mold, where the composite we want to transform is put. The thermal diffusion in the mass mold is reduced relative to other means of heating.

Simulation of Heat-induced Fusing of Polymer Toner

Hoffmann, R.
Océ Printing Systems GmbH, Poing

The electrophotographic print process uses polymer toner particles to create the desired print image on the paper. After depositing the particles on the paper, the particle layer has to be heated beyond the glass point of the polymer to create a homogeneous layer. This fusing process is one of the most energy-consuming parts of the whole print process. It is therefore imperative to limit the ...

Mould heating distribution control system simulation for polymerization of a composite spar for helicopter main rotor blade

Slusar, B.1, Flek, M.1, Rubtsov, Y.1, Shevtsov, S.2, Fomin, A.3
1 Rostov Helicopter Plant «Rostvertol», Rostov-on-Don, Russia
2 Southern Center of Russian Academy of Science, Rostov-on-Don, Russia
3 Don State Technical University, Rostov-on-Don, Russia

High cost and complexity of technological equipment for manufacturing in aeronautical engineering, necessity of fast reequipment for creation of new modifications of flight vehicles make the use of software for modeling prior to design activities very topical. Manufacturing of a polymeric composite spar of the helicopter main rotor blade is an example of technology, where it is necessary to ...

Transient Analysis of the Buoyance Driven Flow in a Passive Solar System of Indoor Heating

G. Petrone, G. Cammarata, and L. Cammarata
Department of Industrial and Mechanical Engineering, University of Catania, Italy

This study aims to numerically investigate on a passive solar system for indoor heating called as \"Trombe wall\". The transient buoyancy driven flow characterizing that system and the thermal distribution are solved by numerically integrating the governing equations in COMSOL Multiphysics environment. Simulations are carried-out for a time range corresponding to 12 days. The results are ...

Coupled Electric-Thermal-Fluid Analysis of High Voltage Bushing

G. Eriksson[1]
[1]ABB, Corporate Research, Västerås, Sweden

Modern power transmission systems are in general designed to operate at high voltages in order to reduce resistive losses generated by high currents. This, however, tends to increase the risk for dielectric breakdown or flashovers if the equipment is not properly designed to withstand the stress. The present work illustrates how multiphysics simulations can be used to analyze and predict the ...

Heat Transfer During a CW Laser Crystallisation Process of a Silicon Thin Film on a Glass Substrate

Bourouga, B.1, Le Meur, G.1, Garnier, B.1, Michaud, J.F.2, Mohammed-Brahim, T.2
1 Laboratoire de Thermocinétique de Nantes
2 IETR – Groupe de Microélectronique-Université Rennes I

Development of new handling microsystems needs integration of field effect thin film transistors made directly on various low temperature substrates, as glass for example, with other functions. Argon laser is used to melt completely and then to crystallize 400 nm thick amorphous silicon films. However, the implementation of this process generates cracking and destruction of the silicon thin film ...

Quick Search