BURLINGTON, MA (July 30, 2010)—COMSOL Inc. is pleased to announce that the newly released COMSOL Multiphysics® version 4.0 has been selected the NASA Tech Briefs 2010 Product of the Year Finalist. The winner was chosen by NASA Tech Briefs’ editors for its outstanding technical merit and practical value to the magazine’s 400,000 engineering and scientific readers. http://www.techbriefs.com/component/content/article/8181
“ We’re thrilled to win the Product of the Year Finalist Award. It feels great that COMSOL version 4.0 is recognized by the NASA Tech Briefs’ editors,” comments Bernt Nilsson, Senior VP of Marketing with COMSOL, Inc. “ Version 4.0 is a major release. We launched an all-new user interface to boost productivity that has been very well received.”
Burlington (July 2, 2010) -- COMSOL, Inc., the makers of COMSOL Multiphysics simulation software, today announces the release of the Plasma Module. Based on COMSOL Multiphysics, the Plasma Module brings easy-to-use tools for the study of low temperature plasmas. The module is designed for researchers, engineers and experimentalists in the field of plasma science to model non-equilibrium discharges which occur in a wide range of engineering disciplines. Target application areas utilizing plasmas include light sources, semiconductor processes, surface coating, and medical sterilization. The module is accompanied by a suite of tutorial and industrially relevant models which serve as both instructional examples and a foundation for future work.
“Simulation of plasmas is a daunting task that is now being addressed for the first time ever using true multiphysics technology,” comments Dan Smith, Lead Developer of the Plasma Module with COMSOL, Inc. “We leverage this technology in the Plasma Module to solve the complex interaction between the electromagnetic fields and charged particles which collectively constitutes plasma. Users will be able to turn to simulation for a wide range of plasma applications that will reduce the need for costly experiments and increase productivity. ”
The Chemical Reaction Engineering Module brings ease of use for the simulation of reacting system. With its built-in CAPE-OPEN support, users can combine thermodynamic property data from multiple third-party software vendors in their COMSOL simulations. The figure shows the results of the simulation of a hydroalkylation process carried out in a membrane reactor.
BURLINGTON, MA (June 18, 2010)— COMSOL Inc, the developer of the market leading COMSOL Multiphysics simulation environment, today releases the Chemical Reaction Engineering Module. This new module is built on the COMSOL platform to create a single environment where engineers and scientists obtain highly accurate studies of material transport and chemical reactions of a wide assortment of chemistries under different operating conditions. Users can simulate reaction systems ranging from micro-reactors in biotechnology to unit operations in chemical processes and gain essential knowledge early in the development phase. The net result is more cost-effective and efficient development cycles for both products and processes.
In this Joule heating effects problem we will demonstrate how to model and simulate the heating of a fuse in a circuit board using the new COMSOL Multiphysics version 4. We will solve how hot a fuse gets in the circuit board when high voltage and current is passed through the fuse.
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New breakthrough user interface makes the power of multiphysics simulation available to a wider audience.
BURLINGTON, MA (April 30, 2010)— COMSOL Inc. announces that version 4.0 of its multiphysics simulation software is now shipping. First unveiled at the 2009 users conference in Boston, COMSOL Multiphysics version 4.0 features an all-new user interface that makes the power of multiphysics simulation available to a wider audience of scientists and engineers. Both expert analysts and non-experts alike will benefit from the organized layout and streamlined model-building process. Along with the release of version 4.0, COMSOL also announces the release of a series of new LiveLink™ options that tightly integrate COMSOL Multiphysics into the mainstream product design workflow. New LiveLink products are now shipping for Autodesk® Inventor®, Pro/ENGINEER®, SolidWorks®, and MATLAB®.
“It feels great to make version 4.0 available,” comments Svante Littmarck, President and CEO of COMSOL, Inc. “We believe this release represents a bold step forward in usability that will increase productivity and problem solving capacity.” Version 4.0 is also a platform for accelerating the pace of development of new functionality. “Customers will notice this effect in the very near future: version 4.0a, available this June, includes three new modules for CFD, Plasma, and Batteries & Fuel Cells,” says Littmarck.
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